In parallel, cooling becomes the defining factor as AI workloads push rack densities to their limits. Precision cooling is delivered through HIREF’ s advanced thermal solutions, while high-density rear-door cooling is enabled through NNDC technologies. Unirom360 deploys these within a specialized thermal architecture engineered specifically for high-density environments.
By enabling targeted heat removal directly at the source, these solutions eliminate thermal hotspots and ensure stable compute performance, maximizing energy efficiency even under continuous, extreme AI-class loads. From racks, containment systems, and busbar architecture to highvoltage distribution panels, fireresistant and industrial servo cables, every component is engineered as part of one integrated design built for continuous load and AI-class scalability.
The company delivers full project executionfrom system architecture and installation to commissioning and lifecycle service-ensuring stable performance, flexible expansion, and long-term resilience without structural compromise.
Looking ahead, Unirom360 continues to expand its data center ecosystem with next-generation cooling, intelligent power architecture, advanced cabling, and softwaredriven infrastructure management.
These solutions are already deployed and trusted by customers such as Bynet DC and other leading operators across Israel, delivering visibility, control, resilience, and efficiency across mission-critical environments built for the accelerating demands of AI.
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