COMPU DYNAMICS
Engineering integration drives density and cooling design For Sengul Topuz, Director of Engineering at CDM, the starting point for every module is thermal, not structural, within this designthrough-delivery process.
“ We begin with the IT equipment’ s thermal profile and build the mechanical architecture around it,” Sengul says, explaining that facility water temperatures, coolant flow rates and residual air-side heat loads are established before any structural or electrical decisions are made.
The measure of success, in her view, goes beyond raw capacity.“ A successful AI module is not simply one with enough cooling capacity,” she says.“ It is one that remains thermally balanced, operates efficiently across varying ambient conditions and IT loads, and provides the flexibility to support future generations of hardware.” That philosophy has guided the company’ s innovative approach to combining liquid and air cooling within a single platform.
“ This principle drove the development of CDM’ s patent-pending dual cooling architecture, where liquid and air cooling operate as complementary systems within one integrated platform,” Sengul explains, adding that the balance between the two shifts automatically as hardware generations and heat loads change.
Maintainability, she stresses, is engineered in from the outset rather than added later.“ At extreme rack densities, maintainability cannot be sacrificed for footprint. We design mechanical systems with concurrent maintenance as a core engineering requirement rather than an afterthought,” Sengul says. compu-dynamics. com 11